solder ball

常見(jiàn)例句

With the same temperature on package, solder ball and PCB board, thermal cycling simulation ignores the thermal gradients in the whole assembly.
熱循環(huán)模擬是在封裝、焊球和PCB基板的任一節(jié)點(diǎn)上施加相同的溫度載荷，忽略了整個(gè)封裝體內(nèi)溫度梯度的存在。
Research status of laser reflow on solder bump forming of area array packages are introduced, and experimental analysis on laser reflow of PBGA solder ball is performed.
介紹了激光重熔在面陣列封裝釬料凸點(diǎn)成形中的研究進(jìn)展，并且對(duì)PBGA共晶釬料球激光重熔進(jìn)行了工藝研究。
Laser bumping is advantageous for its flexibility especially when used for individual solder ball rework and small or medium production of BGA packages, yet it hasn′t been vastly applied presently.
激光植球的優(yōu)勢(shì)在于它的柔性，它適宜于中小批量BGA的生產(chǎn)與個(gè)別焊球的修復(fù)，不過(guò)目前還沒(méi)有投入大規(guī)模的應(yīng)用。