chip bonding
短語(yǔ)詞組
- Flip -chip-bonding equipment 倒裝焊設(shè)備
- flip -chip bonding 倒裝芯片安裝;倒裝晶片安裝;翻譯
- semiconductor chip bonding 半導(dǎo)體芯片焊接
- Thermosonic chip bonding 熱超聲芯片鍵合工藝
- chip bonding pad 芯片焊盤(pán)
- chip bonding layer 芯片鍵合層
- flip chip bonding 倒裝焊接;側(cè)裝片接合;倒裝焊 返回 chip bonding