常見(jiàn)例句

• Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production.
  全自動(dòng)粘片機(jī)是將半導(dǎo)體晶圓微芯片貼裝到引線基架的半導(dǎo)體后工序關(guān)鍵性生產(chǎn)設(shè)備。
返回 bed frame